BigTwin SuperServer SYS-221BT-HNTR All-Flash NVMe Four hot-pluggable systems (nodes) in a 2U form factor

BigTwin SuperServer SYS-221BT-HNTR All-Flash NVMe Four hot-pluggable systems (nodes) in a 2U form factor

BigTwin SuperServer SYS-221BT-HNTR All-Flash NVMe Four hot-pluggable systems (nodes) in a 2U form factor

    

     

Four hot-pluggable systems (nodes) in a 2U form factor Network connectivity via AIOM (OCP 3.0 compliant)

Key Applications

  • All-Flash NVMe Hyperconverged Infrastructure
  • Container-as-a-Service; Application Accelerator
  • High-Performance File System
  • Diskless HPC Clusters
Towar dostępny na zamówienie
SKU
SYS-221BT-HNTR
 
BigTwin

 

BigTwin SuperServer
SYS-221BT-HNTR
(Complete System Only)

 


Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors
  2. Intel® C741
  3. Up to 16 DIMMs ECC DDR5 Slots
  4. 2 PCIe 5.0 x16 (LP) slot;
    Tool-less support
    Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
    Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  5. Network connectivity via AIOM (OCP 3.0 compliant)
  6. 6 hot-swap 2.5" drive bays (2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SATA)
  7. 4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating
    Liquid Cooling Support
  8. 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

Specifications

 

Motherboard
board 
Super X13DET-B
Processor (per Node) 
CPU  Dual Socket E (LGA 4677)
4th Gen Intel® Xeon® Scalable processors 
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Core  Up to 32C/64T; Up to 105MB Cache
Note Supports up to 205W TDP CPUs (Aircooled)*
Supports up to 350W TDP CPUs (Liquid Cooled)
*CPUs (air cooled) with TDP over 205W are only supported under specific conditions. Contact customer support for details.
System Memory (per Node) 
Memory
Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5 RDIMM
On-Board Devices  (per Node) 
Chipset  Intel® C741
Network Connectivity  Via AIOM 
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node) 
LAN  1 RJ45 Dedicated BMC LAN port
USB  2 USB 3.1 port(s) (2 rear)
Video
1 VGA port(s) 
Serial Port  2x M.2 for boot drive or caching  
M.2 form factor: NVMe double-sided 22x110mm
Note: Enterprise-grade M.2 only for caching application
System BIOS
BIOS Type AMI 32MB Flash ROM
Management
Software Supemicro Out of Band (OOB) License (Included per Node)
SuperCloud Composer
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
IPMI 2.0
SUM
Watch Dog
SuperDoctor® 5
Power Configurations ACPI / APM Power Management
PC Health Monitoring
CPU 8+4 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory.
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Chassis
Form Factor 2U Rackmount 
Model CSE-217BQ2-R3K04P 
Dimensions and Weight
Height 3.47" (88mm)
Width  17.68" (449mm)
Depth 28.75" (730mm)
Package 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight Net Weight: 66.1 lbs (30 kg)
Gross Weight: 96.6 lbs (43.8 kg)
Available Color Black front & silver body
Front Panel
Buttons Power On/Off button
UID button
LEDs HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED
Expansion Slots (per Node) 
PCI-Express (PCIe) 2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node) 
Hot-swap 6x 2.5" hot-swap NVMe/SATA drive bays (2x PCI-E 5.0 NVMe and 4x PCI-E 4.0 NVMe/SATA) 
M.2 2 M.2 NVMe
System Cooling
Fans 4x 16K RPM Counter Rotating 8cm Fan(s)
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
Power Supply
PSU
3000W 1U Redundant Power Supply
Total Output Power 3000W : 208 - 240 Vac
3000W : 240 - 240 Vdc for CQC only

Dimension (W x H x L)

45 x 40 x 480 mm 
AC Input 1400W: 100-127Vac / 50-60Hz
2880W: 200-207Vac / 50-60Hz
3000W: 208-240Vac / 50-60Hz
DC Input 3000W: 240-240Vdc for CQC only/ 50-60Hz 
12V SB Max: 4.5A / Min: 0A 
Certification Titanium Level 
Power Supply
RoHS RoHS Compliant
Environmental Spec. Operating Temperature: 
   10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
   -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
   8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 
   5% to 95% (Non-Condensing)
Więcej informacji
Rozmiar obudowy 2U Rack
ilość nodów 4
Procesor CPU 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors
Producent Procesora Intel
podstawka procesora LGA-4677 (Socket E)
Chipset Intel C741
ILOŚĆ PROCESORÓW MULTI CPU
ilość slotów pamięci 16 DIMM slots
Typ pamięci DDR5 DIMM
Standard pamięci DDR5-4800 MHz
interfejs SSD/HDD PCIe 5.0, PCIe 4.0 x4, SATA
rozmiar kieszeni hdd/ssd 2.5" 15mm
kieszenie 2.5'' 6, 24
złącza M.2 2
moc zasilaczy 3000W
ceryfikaty zasilaczy 80 plus Titanium
redundancja zasilaczy 1+1
Application HPC, All Flash Storage, Big Data
Gwarancja 3 lata
Napisz własną recenzję
Tylko zarejestrowani użytkownicy mogą pisać Recenzje. Proszę Zaloguj się lub Załóż konto
test
Znaleźliśmy inne produkty, które mogą Cię zainteresować!
Zapytaj o cenę
Trwa wysyłanie wiadomości...

Wiadomość została wysłana. Dziękujemy.

Wiadomość NIE została wysłana. Prosimy wypełnić prawidłowo wszystkie pola.
Wiadomość NIE została wysłana. Prosimy o kontakt z Działem Handlowym.
Produkt

Konfiguracja

Imię i nazwisko
Adres e-mail
Nazwa firmy
Treść wiadomości