Gigabyte 5U G593-SD1-AAX1 5th/4th Gen Intel Xeon Scalable - 5U DP NVIDIA HGX H100 8-GPU 8-Root Port (BF-3)

Gigabyte 5U G593-SD1-AAX1 5th/4th Gen Intel Xeon Scalable - 5U DP NVIDIA HGX H100 8-GPU 8-Root Port (BF-3)

Gigabyte 5U G593-SD1-AAX1 5th/4th Gen Intel Xeon Scalable - 5U DP NVIDIA HGX H100 8-GPU 8-Root Port (BF-3)

    

     

Gigabyte 5U G593-SD1-AAX1 5th/4th Gen Intel Xeon Scalable - 5U DP NVIDIA HGX H100 8-GPU 8-Root Port (BF-3)
Towar dostępny na zamówienie
SKU
6NG593SD1DR000AAX1

G593-SD1-AAX1
 
 HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP NVIDIA HGX™ H100 8-GPU 8-Root Port (BF-3)


NVIDIA-Certified Systems™ - Data Center Servers
NVIDIA HGX™ H100 with 8 x SXM5 GPUs
900GB/s GPU-to-GPU bandwidth with NVIDIA® NVLink® and NVSwitch™
Dual 5th/4th Gen Intel® Xeon® Scalable Processors
Dual Intel® Xeon® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
Compatible with NVIDIA BlueField®-3 DPUs/SuperNICs
2 x 10Gb/s LAN ports via Intel® X710-AT2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
4 x FHHL PCIe Gen5 x16 slots
8 x LP PCIe Gen5 x16 slots
4+2 3000W 80 PLUS Titanium redundant power supplies


High Performance
Supports NVIDIA HGX™ H100 8-GPU
The NVIDIA H100 Tensor Core GPU enables an order-of-magnitude leap for large-scale AI and HPC with unprecedented performance, scalability and security for every data center. With NVIDIA AI Enterprise for streamlined AI development and deployment, NVIDIA NVLINK Switch System direct communication between up to 256 GPUs, H100 accelerates everything from exascale scale workloads with a dedicated Transformer Engine for trillion parameter language models, down to right-sized Multi-Instance GPU (MIG) partitions.



Dimensions (WxHxD, mm)
5U
447 x 219.7 x 945
Motherboard
MSB3-G41
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Front side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear side:
1 x 10/100/1000 Mbps Management LAN

Notice: When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
8 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays, NVMe from PEX89104

*SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5

Support optional RAID add-in cards

Expansion Slots
NVIDIA HGX™ H100 with 8 x SXM5 GPUs

Extension Board CPBG044 x 2:
- 8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104

Riser Card CPBGD20 x 2:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from PEX89048
Internal I/O
1 x TPM header
1 x VROC connector
Front I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
1 x MLAN
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
Red Hat Enterprise Linux 9.2 or later (x86_64)
Windows Server 2022 (x64)
System Fans
Motherboard:
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)

PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (32,000rpm)

GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 91 kg
Gross Weight: 100 kg
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-SD1-AAX1
2 x CPU heatsinks
6 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module (5/4th Gen): 6NG593SD1DR000ABX1*
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD1DR000AAX1*
- Motherboard: 9MSB3G41NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562M-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Riser card - CPBGD20: 9CPBGD20NR-00
- I/O board - CDB66: 9CDB66NR-00
- PCIe extension board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- G-SCM board - CDCG120: 9CDCG120UR-00
- Power supply: 25EP0-23000J-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG593SD1SR-RMA-A100

Więcej informacji
Rozmiar obudowy 5U Rack
ilość nodów 1
Procesor CPU 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors
Producent Procesora Intel
podstawka procesora LGA-4677 (Socket E)
ILOŚĆ PROCESORÓW 2xCPU
ilość slotów pamięci 32 DIMM slots
Typ pamięci DDR5 DIMM
Standard pamięci DDR5-4800 MHz
moc zasilaczy 3000W
ceryfikaty zasilaczy 80 plus Titanium
redundancja zasilaczy tak
Application GPU server, AI, AI Training, AI Inference and Machine Learning, AI / Deep Learning
Gwarancja 3 lata
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