3rd Gen Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
Supports Intel® Optane™ Persistent Memory 200 series
Dual ROM Architecture
Intel® C621A Chipset
8 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
4 x Dedicated management ports
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x LP PCIe Gen4 x16 slots
4 x OCP 2.0 Gen3 x16 mezzanine slots
Dual 2200W 80 PLUS Platinum redundant power supply
3rd Gen Intel® Xeon® Scalable Processors – “Ice Lake”
| Rozmiar obudowy | 2U Rack |
|---|---|
| ilość nodów | 4 |
| Procesor CPU | 3rd Gen Intel® Xeon® Scalable processors |
| Producent Procesora | Intel |
| podstawka procesora | FC-LGA4189 (Socket P+) |
| Chipset | Intel C621A |
| ILOŚĆ PROCESORÓW | 2xCPU |
| ilość slotów pamięci | 16 DIMM slots |
| Typ pamięci | DDR4 DIMM |
| Standard pamięci | DDR4-3200 MHz |
| Total PCI-E Slots# | 3, 12 |
| interfejs SSD/HDD | PCIe 4.0 x4, SATA |
| rozmiar kieszeni hdd/ssd | 2.5" 15mm |
| kieszenie 2.5'' | 2, 6 |
| moc zasilaczy | 2200W |
| ceryfikaty zasilaczy | 80 plus Titanium |
| redundancja zasilaczy | 1+1 |
| Application | HPC, Hybrid/Private Cloud Server |
| Gwarancja | 3 lata |
Konfiguracja
