Hyper SuperServer SYS-121H-TNR Dual Socket E (LGA-4677) 32 DIMM 3xPCIe 5.0 x16 8x 2.5-inch NVMe/SAS/SATA

Hyper SuperServer SYS-121H-TNR Dual Socket E (LGA-4677) 32 DIMM 3xPCIe 5.0 x16 8x 2.5-inch NVMe/SAS/SATA

Hyper SuperServer SYS-121H-TNR Dual Socket E (LGA-4677) 32 DIMM 3xPCIe 5.0 x16 8x 2.5-inch NVMe/SAS/SATA

    

     

Hyper SuperServer SYS-121H-TNR Dual Socket E (LGA-4677) 32 DIMM 3xPCIe 5.0 x16 8x 2.5-inch NVMe/SAS/SATA
Towar dostępny na zamówienie
SKU
SYS-121H-TNR

Complete System Only

Hyper SuperServer SYS-121H-TNR

Virtualization
Software-defined Storage
AI Inference and Machine Learning
Cloud Computing
Enterprise Server


Key Features

  1. Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
  3. 3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards
  4. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
  5. 8x 2.5" hot-swap NVMe/SATA/SAS drive bays;
  6. Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays;
  7. 2x internal M.2 NVMe/SATA drive slots;
  8. Optional RAID support via storage add-on card
  9. 8 heavy duty hot-swap fans with optimal fan speed control

Specifications

Motherboard
  SuSuper X13DEM
Processor
CPU Dual Socket E (LGA-4677)
 4th Gen Intel® Xeon® Scalable processors 
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Cores Up to 52C/104T; Up to 97.5MB Cache
Note Supports up to 350W TDP CPUs (Aircooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
CPUs (air cooled) with TDP over 250W are only supported under specific conditions. Contact customer support for details.
System Memory
Memory Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5
Memory Voltage
Memory Voltage 1.1 V
Error Detection ECC
On-Board Devices (per Node) 
NVMe/SATA NVMe; SATA3 (6Gbps); RAID 0/1/5/10 support 
Chipset Intel® C741
Network Connectivity 2x 1GbE BaseT with Intel® i350-AM2 (optional)
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
2x 10GbE BaseT with Intel® X550-AT2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated BMC LAN port
SATA 8 SATA (6Gbps) port(s) 
USB 1 USB 3.0 port(s) (1 front)
2 USB 2.0 port(s) (2 rear)
Video 1 VGA port(s)
Serial Port 2 COM Port(s) (1 header; 1 rear)
System BIOS
BIOS Type AMI 256MB SPI Flash
Management
Software IPMI2.0
Redfish API
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Power Configurations ACPI Power Management
PC Health Monitoring
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor 1U Rackmount 
Model CSE-HS119-R1K24P2 
Dimensions
Height 1.7" (43mm)
Width 17.2" (437mm)
Depth 29.4" (747mm)
Package 8.1" (H) x 23.8" (W) x 40.6" (D)
Weight Net Weight: 34 lbs (15.4 kg)
Gross Weight: 49 lbs (22.2 kg)
Available Color Silver/Black
Front Panel
Buttons Power On/Off 
UID button
LEDs HDD activity
LAN1 activity
Power status
System information
Expansion Slots
PCI-Express (PCIe) 2 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 5.0 x8 LP slot(s)
Note
Default loadout. (For more configs, please contact sales)
FH slots can be reconfigured with RSC-W2-688G5. Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length)
Drive Bays / Storage (per Node) 
Drive Bays 8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Configurable option for 12x 2.5" hot-swap NVMe/SAS/SATA drive bays. NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.) 
M.2 2 M.2 NVMe OR 2 M.2 SATA3
System Cooling
Fans 8x 4cm heavy duty fans with optimal fan speed control 
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
 Power Supply
PSU 1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply
Dimension (W x H x L) 76 x 40 x 336 mm 
AC Input 800W: 100-127Vac / 9.8A-7A / 50-60Hz
1200W: 200-240Vac / 7.5A-6A / 50-60Hz

12V SB 

+12V
 

Max: 2.1A / Min: 0A 

Max: 83A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)

Output Type  25 Pairs Gold Finger Connector
Certification Titanium Level 
Operating Environment
Environmental Spec.
Operating Temperature: 
Operating Temperature: 
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
8% to 90% (non-condensing)
Non-operating Relative Humidity: 
5% to 95% (non-condensing)
Więcej informacji
Rozmiar obudowy 1U Rack
ilość nodów 1
Procesor CPU 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors, Intel® Xeon® CPU Max Series
Producent Procesora Intel
podstawka procesora LGA-4677 (Socket E)
Chipset Intel C741
ILOŚĆ PROCESORÓW 2xCPU
ilość slotów pamięci 32 DIMM slots
Typ pamięci DDR5 DIMM
Standard pamięci DDR5-4800 MHz
ilość GPU/HPC 3
interfejs SSD/HDD PCIe 4.0 x4, 16G SAS, 24G SAS, SATA
rozmiar kieszeni hdd/ssd 2.5" 15mm
kieszenie 2.5'' 8
złącza M.2 2
moc zasilaczy 800W, 1200W
ceryfikaty zasilaczy 80 plus Titanium
redundancja zasilaczy tak, 1+1
Application AI Inference and Machine Learning, Software Defined Storage, Hybrid/Private Cloud Server
Gwarancja 3 lata
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