| Included | Required Items (sold separately) | Optional Accessories (sold separately) |
| (1) – 2U 3.5″ chassis – iPN M36819-xxx (1) – Server board – iPC M50FCP2SBSTD (1) – 12 drive hot-swap drive bay assembly (1) 12 x 3.5 combo HSBP – iPC CYPHSBP2312 (12) 3.5″ HDD/SSD drive carriers – iPN J36447-xxx (1) HSBP power cable – iPN K67596-xxx (1) I2C cable, server board to HSBP – iPN K63231-xxx (2) – Riser card assembly brackets (1) – Front panel (left) with two USB ports – iPN K48177-xxx (1) – Front Panel (left) USB cable – iPN K67061-xxx (1) – Front panel (right) with Control Panel – iPN K48178-xxx (1) – Front panel (right) cable pin – iPN K67059-xxx (6) – Single-rotor system fans – iPC CYPFAN2UKIT (16) – DIMM blanks – iPN M45676-xxx (1) – Standard 2U air duct (for 2U-Tall HS) – iPC FCPDUCTSTD (2) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket (2) – E1A (XCC) processor clips – iPC AXXSPRXCCCC (2) - E1B (MCC) processor clips - iPC AXXSPRMCCCC |
(1) or (2) power supply modules & power cord(s) • Rack mount kit • (1) or (2) 2U CPU heat sink • (1) or (2) 4th Gen Intel® Xeon® Scalable processor(s) • Up to 32 ECC registered DDR5 DIMMs |
Backplane compatible storage drives – NVMe, SATA, SAS • Front drive data interface cables • Intel® Ethernet Network Adapter for OCP • 1U CPU Heat Sink and 1U Heat sink compatible air duct |
| Rozmiar obudowy | 2U Rack |
|---|---|
| ilość nodów | 1 |
| Procesor CPU | Intel® Xeon® Scalable |
| Producent Procesora | Intel |
| podstawka procesora | LGA-4677 (Socket E) |
| Chipset | Intel C741 |
| ILOŚĆ PROCESORÓW | 2xCPU |
| ilość slotów pamięci | 32 DIMM slots |
| Typ pamięci | DDR5 DIMM |
| Standard pamięci | DDR5-4800 MHz |
| ilość GPU/HPC | 2 |
| interfejs SSD/HDD | PCIe 5.0, 16G SAS, 24G SAS, SATA |
| rozmiar kieszeni hdd/ssd | 3.5 (LFF) |
| kieszenie 2.5'' | 12 |
| kieszenie 3.5'' | 12 |
| złącza M.2 | optional |
| ceryfikaty zasilaczy | 80 plus Titanium |
| redundancja zasilaczy | opcja, tak |
| Gwarancja | 3 lata |
Konfiguracja
