Intel® Xeon® w5-2455X Processor 12C 30M Cache, 3.20 GHz FCLGA4677 DDR5-4800 (MT/s) 240W SRM9G PK8071305127200

Intel® Xeon® w5-2455X Processor 12C 30M Cache, 3.20 GHz FCLGA4677 DDR5-4800 (MT/s) 240W SRM9G PK8071305127200

Intel® Xeon® w5-2455X Processor 12C 30M Cache, 3.20 GHz FCLGA4677 DDR5-4800 (MT/s) 240W SRM9G PK8071305127200

    

     

Intel® Xeon® w5-2455X Processor 12C 30M Cache, 3.20 GHz FCLGA4677 DDR5-4800 (MT/s) 240W SRM9G PK8071305127200
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PK8071305127200

Procesory Intel® Xeon® W


Intel® Xeon® W-3400 & Intel® Xeon® W-2400 Processors and the Intel® W790 Chipset for Workstations

 

Intel® Xeon® W-3400 and Xeon® W-2400 processors deliver the ultimate workstation platform to power the next generation of compute-intensive professional workloads. Paired with the Intel® W790 Chipset, professionals can experience high performance compute and reliability, in addition to expanded peripherals—high-speed network cards, graphics accelerators, and large volume storage arrays—for increased productivity and configuration flexibility. The multi-die architecture brings a revolutionary increase in core counts to accelerate high-thread computing for workstation tasks like 3D rendering, product visualization and simulation, and scientific computing. Innovative platform capabilities, including up to 112 lanes of PCIe Gen 5.0 connectivity, up to 4TB of DDR5 RDIMM memory support, and up to 5x USB 3.2 Gen 2x2 ports provide the configuration flexibility for professionals to meet intricate compute demands with ease.

Breakthrough Compute Architecture

Intel® Xeon® W-3400 and Xeon® W-2400 processors represent an architectural turning point in power and scalability for professional high-end compute needs. These processors bring a breakthrough in advanced CPU packaging technology featuring Embedded Multi-die Interconnect Bridge (EMIB) technology which elegantly connects multiple heterogeneous die in a single solution, alleviating processing bottlenecks and enabling up to 56 cores in a single socket. This gives professionals double the core counts over the previous leading generation of Intel® Xeon® W processors to manage compute-intensive, highly threaded workflows. At the same time, CPU speeds of up to 4.8 GHz with Intel® Turbo Boost Max Technology 3.0 optimize core performance on-demand for lightly-threaded applications, increasing system responsiveness. An expanded Intel® Smart Cache of up to 105MB reduces latency in complex workloads, like code compilation or rendering, by reducing the amount of time spent swapping data between cache and memory. With this all-new compute architecture designed to optimize CPU performance across workloads, creatives, engineers, and data scientists can work at their best.

Designed for Professionals

Workstations based on Intel® Xeon® W-3400 and Xeon® W-2400 platforms provide the world-class features that you need to dive fearlessly into your workflow. Manage complex Machine Learning (ML) & Artificial Intelligence (AI) workloads end-to-end with 3rd Generation Intel® Deep Learning Boost1 to accelerate training and inferencing of AI models. Support for select Intel vPro® Enterprise technology2 enables a seamless, reliable system management experience for uninterrupted workflow productivity. Support for DDR5 RDIMM Error Correction Code (ECC) Memory and reliability, availability, and serviceability (RAS) features guard against system errors to protect critical data integrity and system reliability to maximize uptime. Let Intel Xeon W-3400 and Xeon W-2400 processors for workstation elevate your workflow performance and drive the future of professional excellence.

Cutting-Edge Platform Technologies

Complemented by a full range of next-generation technologies, Intel® Xeon® W-3400 and Xeon® W-2400 processor-based workstation platforms enable professionals to work, connect, analyze, and create like never before. Up to 112 PCIe Gen 5.0 lanes of CPU attached connectivity give you the configuration flexibility to equip the right combination of hardware accelerators like multiGPUs, SSDs and network cards to take on any task. Additionally, the Intel W790 Chipset features up to 16 PCIe Gen 4.0 lanes for high-speed access to additional SSD storage for your most often used reference files while increased DMI lanes (from x4 to x8) and throughput (from 3.0 to 4.0) between the chipset and processor remove data bandwidth bottlenecks in your workflow. Enhance your productivity with up to 8-channels of DDR5 RDIMM memory for power savings, faster memory speeds, and higher memory bandwidth.3 Access important data on-demand to meet your deadlines with integrated Intel® Wi-Fi 6E and 2.5 GbE wired network connectivity and boost your productivity with support for up to 5 USB 3.2 Gen 2x2 (20G) ports to transfer large videos and project files or larger data sets between devices. With these and other world-class platform innovations, professionals can leverage the flexibility, expandability, and performance that they need to succeed.

 

Media & Entertainment Architecture, Engineering, Construction

Intel® Xeon® W-3300 processors are designed for the most demanding workloads and applications such as 8K video editing, simulations, and advanced CAD, CAE, and MCAD.

Intel® Xeon® W-3375 Processor versus Intel® Xeon® W-3275 Processor
Up to 26% faster Preview Rendering in AutoDesk Maya13
Up to 20% faster Editing/Encoding Performance in Adobe Premiere Pro Workloads14
Up tp 45% faster Multi-Threaded Performance in Cinebench R23 Workloads15

Reliability, Availability, & Serviceability (RAS) Technology

When productivity loss from system downtime could cost thousands or even millions, you want technology to help reliably avoid, diagnose, and repair system-level faults. That’s why Intel® Xeon® W-3300 processors come with RAS technologies like (but not limited to):

DDR4 Command/Address Parity Check and Retry
Out-of-band access to error logs
PCIe Card Hot Plug (add/remove/swap)
Predictive Failure Analysis

  • Intel® Xeon® W-3400 and Intel® Xeon® W-2400 Processors Features at a Glance
  • New Processor Core Architecture
    Utilizes Embedded Multi-die Interconnect Bridge (EMIB) packaging technology to deliver a scalable architecture, increasing core-counts in a single socket for the next generation of workstations
  • Up to DDR5 ECC RDIMM 4800 MT/s4
    Delivers up to 4TB of memory support for power savings, faster memory speeds, and higher memory bandwidth
  • PCIe 5.0 up to 112 Lanes
    Offers readiness for up to 224 GT/s for fast access to peripheral devices and networking with up to 112 PCI Express 5.0 lanes
    Increased L2 Cache and L3 Shared Intel® Smart Cache
  • Up to 105MB for increased performance and data management by reducing time spent swapping data between cache and memory
  • 3rd Gen Intel® Deep Learning Boost1
  • Accelerates training and inferencing of AI models enabling developers’ end-to-end workflow Solution designed, validated, and tested by Intel data scientists
  • Support for select Intel vPro® Enterprise Technology2
  • Give IT professionals the tools for easy system integration & management of workstation platforms into existing enterprise networks
  • ECC Memory Support
  • Error-Correcting Code memory detects and corrects errors and improves the integrity of essential data without workflow interruption
  • Intel® Turbo Boost Max Technology 3.0
  • Identifies the processor's fastest cores and directs critical workloads to them
  • Intel® Turbo Boost Technology 2.0
  • Intelligently boosts the processor to run faster than its rated frequency as power, heat, and workload allow
  • Intel® W790 Chipset Features at a Glance
Więcej informacji
Producent Procesora Intel
rdzenie procesora 12
podstawka procesora LGA-4677 (Socket E)
Typ pamięci DDR5 DIMM
technologia procesora 7nm
zegar podstawowy procesora 3.2
zegar TURBO procesora 4.6
Cache procesora 30MB L3
typ opakowania OEM
Gwarancja 3 lata
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