Complete System Only
- Enterprise data center
- EDA, Cloud
- High-performance Computing (HPC)
| Motherboard | |
| board | Super
MBD-B13DE |
| Processor | |
| CPU | Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM) |
| Cores | Up to 52C/104T; Up to 97.5MB Cache |
| Note | Supports up to 350W TDP CPUs (Aircooled) |
| System Memory |
|
| Memory | 16 DDR5 DIMM slots 1DPC with 4800MHz ECC RDIMM Supports Intel® Optane™ persistent memory (PMem) 300 series |
| Memory Voltage | 1.1 V |
| Error Detection | ECC |
| On-Board Devices (per Node) | |
| NVMe/SATA | NVMe; SATA3 (6Gbps); RAID 0/1/5/10 support |
| Chipset | Intel® C741 |
| Network Connectivity | Onboard Dual 25G Ethernet 1 Mezzanine expansion slot and 3 different optional Mezzanine card. 1 OCP 3.0 network card (option) Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR* |
| IPMI | IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust |
| Input / Output |
|
| LAN | Onboard Dual 25G Ethernet 1 Mezzanine expansion slot and 3 different optional Mezzanine card. 1 OCP 3.0 network card (option) Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR* |
| System BIOS | |
| BIOS Type | 256Mb SPI Flash EEPROM with AMI® BIOS |
| Management | |
| BIOS Features | Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support |
| Dimensions | |
| Height | 6.5" |
| Width | 3.5" |
| Depth | 23.5" |
| Package | 7.4" (H) x 19.3" (W) x 23.3" (D) |
| Weight | 11.5 lbs (5.2 kg) |
| Available Color | Black |
| Front Panel | |
| Buttons | Power On/Off button |
| LEDs | Power LED UID Network Activity LED Fault LED |
| Note |
SUV (Serial/USB/Video) Connector |
| Drive Bays / Storage (per Node) | |
| Drive Bays | 2 Hot-swap U.2 NVMe/SATA3 drive bays 1 Hot-swap SATA3 drive bay |
| M.2 | 1 M.2 2280 Optional: 4 M.2 NVMe via mezz card |
| Operating Environment | |
| Environmental Spec. Operating Temperature: |
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) -40°C to 60°C (-40°F to 140°F) 8% to 90% (non-condensing) 5% to 95% (non-condensing) |
| Rozmiar obudowy | 4U Rack |
|---|---|
| ilość nodów | 1 |
| Procesor CPU | 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors |
| Producent Procesora | Intel |
| podstawka procesora | LGA-4677 (Socket E) |
| Chipset | Intel C741 |
| ILOŚĆ PROCESORÓW | 2xCPU |
| ilość slotów pamięci | 16 DIMM slots |
| Typ pamięci | DDR5 DIMM |
| Standard pamięci | DDR5-4800 MHz |
| interfejs SSD/HDD | PCIe 4.0 x4 |
| rozmiar kieszeni hdd/ssd | 2.5" 15mm |
| kieszenie 2.5'' | 3 |
| złącza M.2 | 1 |
| redundancja zasilaczy | tak |
| Application | HPC, Hybrid/Private Cloud Server |
| Gwarancja | 3 lata |
Konfiguracja
