Product SKUs
SuperServer SYS-241E-TNRTTP
Motherboard
Super X13QEH+
Processor
CPU
Quad Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors
Note
Supports 165W - 250W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
GPU
Max GPU Count
Up to 2 double-width GPU(s)
Supported GPU
NVIDIA PCIe: RTX A6000
View GPU Options
CPU-GPU Interconnect
PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
PCIe
System Memory
Memory
Slot Count: 64 DIMM slots
Max Memory (2DPC): Up to 8TB 4800MT/s ECC DDR5 RDIMM
View Memory Options
On-Board Devices
Chipset
Intel® C741
Network Connectivity
Via AIOM
View AIOM Options
View AOC Options
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
NVMe
View NVMe Options
Input / Output
LAN
1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
2 USB 3.0 port(s) (rear)
2 USB 2.0 port(s) (front)
Video
1 VGA port(s)
1 DisplayPort port(s)
Serial
1 COM port(s) (Rear)
System BIOS
BIOS Type
AMI 32MB SPI Flash EEPROM
Management
Software
SuperCloud Composer
Supermicro Server Manager (SSM)
Supermicro Update Manager (SUM)
SuperDoctor® 5
Super Diagnostics Offline
TAS: Supermicro Thin-Agent Service (TAS)
SAA(new!)
IPMICFG
SMCIPMITool
IPMIView
Power configurations
Power-on mode for AC power recovery
ACPI Power Management
Security
Hardware
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory
4+1 Phase-switching voltage regulator
FAN
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor
2U Rackmount
Model
CSE-218HTS-R3K2AWP
chassisWeight
Net Weight: 45.5 lbs (20.64 kg)
Gross Weight: 71.5 lbs (32.43 kg)
Dimensions and Weight
Height
3.5" (87.9 mm)
Width
17.3" (438.4 mm)
Depth
33.4" (849.3 mm)
Package
9.75" (H) x 26.5" (W) x 43.5" (D)
Weight
Gross Weight: 71.5 lbs (32.43 kg)
Net Weight: 45.5 lbs (20.64 kg)
Available Color
Black
Front Panel
LED
HDD activity
Network activity
Power status
System information (overheat/UID)
Buttons
Power On/Off
UID
Expansion Slots
PCI-Express (PCIe) Configuration
Default
3 PCIe 5.0 x8 FHHL slot(s)
3 PCIe 5.0 x16 FHHL slot(s)
1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible)
1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Option A
2 PCIe 5.0 x16 FHFL double-width slot(s)
2 PCIe 5.0 x16 FHHL slot(s)
1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible)
1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
View AOC Options
Drive Bays / Storage
Drive Bays Configuration
Default: Total 8 bay(s)8 front hot-swap 2.5" SATA drive bay(s)
Option A: Total 24 bay(s)24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
View Drive Options
M.2
2 M.2 PCIe 3.0 x4 NVMe/SATA slot(s) (M-key 2280/22110)
View M.2 Options
System Cooling
Fans
4 Direct to Chip (D2C) Cold Plate Fan(s) (optional)
6 Heavy duty counter-rotating 6cm Fan(s)
Liquid Cooling
Direct to Chip (D2C) Cold Plate (optional)
Power Supply
4x 1600W Redundant (2 + 2) Titanium Level power supplies
Dimension (WxHxL)
73.5 x 40 x 203 mm
+12V
Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133A / Min: 0A (200Vac-240Vac)
12V SB
Max: 2.1A / Min: 0A
AC Input
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac / 50-60Hz
Output Type
Backplanes (gold finger)
Certification
Titanium Level
[Test Report]
Operating Environment
ROHS
RoHS Compliant
Environmental Spec.
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
Rozmiar obudowy | 2U Rack |
---|---|
ilość nodów | 1 |
Procesor CPU | 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors |
Producent Procesora | Intel |
podstawka procesora | LGA-4677 (Socket E) |
Chipset | Intel C741 |
ILOŚĆ PROCESORÓW | 2xCPU |
ilość slotów pamięci | 64 DIMM slots |
Typ pamięci | DDR5 DIMM |
Standard pamięci | DDR5-4800 MHz |
Total PCI-E Slots# | 6 |
ilość GPU/HPC | 2 |
interfejs SSD/HDD | PCIe 4.0 x4, SATA |
rozmiar kieszeni hdd/ssd | 2.5" 15mm |
kieszenie 2.5'' | 8, 24 |
złącza M.2 | 2 |
moc zasilaczy | 1600W |
ceryfikaty zasilaczy | 80 plus Titanium |
redundancja zasilaczy | 1+1 |
Application | GPU server, AI, Visual Computing, Virtualization |
Gwarancja | 3 lata |
Konfiguracja