Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3
Supports CPU TDP up to 280W*
Cores
Up to 128 Cores (64 per CPU)
Note
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
GPU
Supported GPUs
SXM Multi-GPU Board 8-GPU
HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e)
CPU-GPU Interconnect
PCI-E Gen 4 x16 Switch CPU-to-GPU Interconnect
GPU-GPU Interconnect
NVIDIA® NVLink™ with NVSwitch™ GPU-GPU Interconnect
System Memory
Memory Capacity
32 DIMM slots
Up to 8TB 3DS ECC DDR4-3200MH RDIMM/LRDIMM
Memory Type
3200MHz ECC DDR4 RDIMM/LRDIMM
On-Board Devices
Chipset
System on Chip (SoC)
SATA
SATA3 (6Gbps)
Network Controllers
Provided via AIOM
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
29.5" (750mm) H x 27.4" (695mm) W x 44.9" (1140mm) D
Weight
Net Weight: 166.0 lbs (75.3 kg)
Gross Weight: 225.0 lbs (102.1 kg)
Drive Bays / Storage
Hot-swap
6 hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU, SATA/NVMe Hybrid or SAS with optional HBA) (up to 10 hot-swap U.2 NVMe 2.5" available)
Expansion Slots
PCI-Express
8 PCI-E 4.0 x16 via PCI-E switch - supporting HGX A100 8-GPU's 1:1 connection to 8 NICs
1 PCI-E 4.0 x16 LP and 1 PCI-E 4.0 x8 LP via CPUs
System Cooling
Fans
4 x Hot-swap 11.5K RPM heavy duty fans
Power Supply
3000W Redundant Titanium Level Power Supplies
Dimension (W x H x L)
106.5 x 82.4 x 203.5 mm
Certification
Titanium Level
Operating Environment
RoHS
RoHS Compliant
Environmental Spec.
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Titanium Level
