Key Applications
Virtualization, Software-defined Storage, AI Inference and Machine Learning,
Cloud Computing, Enterprise Server,
Key Features
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors;
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent
Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4
LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series;
Optional PCIe slot configurations up to 8 PCIe 4.0 x8 or 4 PCIe 4.0 x16 slots
with support for double-width GPU/Accelerator cards;
Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0
compatible);
24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 2x internal M.2 NVMe/SATA
drive slots; Optional RAID support via storage add-on card;
4 heavy duty hot-swap fans with optimal fan speed controlProcesory Dual Socket P+ (LGA-4189) 3. generacji Intel® Xeon® Scalable; 32 gniazda DIMM; Do 8 TB pamięci DRAM; Do 8 TB pamięci Intel® Optane™ Persistent (pamięć do 12 TB z pamięcią DRAM); ECC DDR4 3200/2933/2666 LRDIMM; RDIMM; Pamięć Intel® Optane™ Persistent Memory serii 200; Opcje konfiguracji gniazd PCIe do 8 gniazd PCIe 4.0 x8 lub 4 gniazd PCIe 4.0 x16 z obsługą kart GPU/Accelerator o podwójnej szerokości; Elastyczne opcje sieciowe z maksymalnie 2 gniazdami AIOM (zgodne z OCP NIC 3.0); 24 zatoki na dyski NVMe/SATA/SAS do wymiany na gorąco; 2 wewnętrzne gniazda dysków M.2 NVMe/SATA; Opcjonalne wsparcie dla macierzy RAID za pośrednictwem karty dodatkowej do magazynowania; 4 wydajne wentylatory do wymiany na gorąco z optymalną kontrolą prędkości wentylatorów
| Motherboard | Super X12DHM-6 |
| Processor | |
| CPU | Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Support CPU TDP 270W |
| Cores | Up to 40C/80T; Up to 60MB Cache per CPU |
| System Memory | |
| Memory | Memory Capacity: 16 DIMM slots Up to 4TB: PMem and DRAM Memory Type: 3200MHz ECC LRDIMM/RDIMM DDR4 Intel® Optane™ persistent memory 200 series |
| Memory Voltage | 1.2 V |
| Error Detection | ECC |
| On-Board Devices | |
| Chipset | Intel® C621A |
| Network Connectivity | 2x 10GbE port(s) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| LAN | 1 dedicated IPMI LAN port |
| USB | 2 USB 3.0 port(s) (rear) |
| Video | 1 VGA port(s) |
| Serial Port | 2 COM Port(s) (1 rear) |
| DOM | n/a |
| System BIOS | |
| BIOS Type | AMI 256MB SPI Flash |
| Management | |
| Software | Redfish API Supermicro Server Manager (SSM) Supermicro Power Manager (SPM) Supermicro Update Manager (SUM) SuperDoctor® 5 Super Diagnostics Offline KVM with dedicated LAN IPMI 2.0 |
| Power Configurations | Power-on mode for AC power recovery ACPI Power Management |
| GPC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-HS219-R1K63P |
| Dimensions and Weight | |
| Height | 3.5" (88.9 mm) |
| Width | 17.2" (437mm) |
| Depth | 29.9" (760 mm) |
| Package | 10.4" (H) x 23.8" (W) x 43.6" (D) |
| Weight | Gross Weight: 66 lbs (30 kg) Net Weight: 40 lbs (18.2 kg) |
| Available Color | Black |
| Front Panel | |
| Buttons | Power On/Off UID button |
| LEDs | HDD activity LAN1 activity Power System information |
| Expansion Slots | |
| PCI-Express (PCIe) | Default* 8 PCIe 4.0 x8 (in x16) FH/10.5″L slot(s) 2 PCIe 4.0 x16 AIOM slot(s) (OCP 3.0 compatible) Option A* 2 PCIe 4.0 x8 (in x16) FH/10.5″L slot(s) 3 PCIe 4.0 x16 FH/10.5″L slot(s) 2 PCIe 4.0 x16 AIOM slot(s) (OCP 3.0 compatible) |
| Drive Bays / Storage | |
| Hot-swap | Default: Total 24 bay(s)24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s) (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details) |
| M.2 | 2 M.2 NVMe/SATA slot(s) (M-key 2280/22110) |
| Max GPU Count | Up to 4 double-width GPU(s) |
| System Cooling | |
| Fans | 4 counter-rotating 80x80x38mm Fan(s) |
| Power Supply | |
| 2x 1600W Redundant Titanium Level Hot-plug power supplies | |
| Dimension | 73.5 x 40 x 265 mm |
| AC Input | 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac / 50-60Hz 1600W: 200-240Vdc / 50-60Hz (for CQC only) |
| +12V | Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133.3A / Min: 0A (200Vac-240Vac) |
| 5V SB | Max: 4A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Certification | Titanium Level |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Rozmiar obudowy | 2U Rack |
|---|---|
| ilość nodów | 1 |
| Procesor CPU | Intel® Xeon® Scalable |
| Producent Procesora | Intel |
| podstawka procesora | FC-LGA4189 (Socket P+) |
| Chipset | Intel C621A |
| ILOŚĆ PROCESORÓW | 2xCPU |
| ilość slotów pamięci | 32 DIMM slots |
| Typ pamięci | DDR4 DIMM |
| Standard pamięci | DDR4-3200 MHz |
| ilość GPU/HPC | 4 |
| interfejs SSD/HDD | PCIe 4.0 x4, SATA |
| rozmiar kieszeni hdd/ssd | 2.5" 15mm |
| kieszenie 2.5'' | 24 |
| złącza M.2 | 2 |
| moc zasilaczy | 1600W |
| ceryfikaty zasilaczy | 80 plus Platinum |
| redundancja zasilaczy | tak |
| Gwarancja | 3 lata |
Konfiguracja
