Supermicro SuperServer SYS-521C-NR 1x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 2U 12x3.5'' HDD 2x1200W PSU Via AIOM & AOC 4x8 FHFL/2x16 FHHL PCI-E     2x PCIe3.0x 2xM-key, 2280, 22110

Supermicro SuperServer SYS-521C-NR 1x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 2U 12x3.5'' HDD 2x1200W PSU Via AIOM & AOC 4x8 FHFL/2x16 FHHL PCI-E 2x PCIe3.0x 2xM-key, 2280, 22110

Supermicro SuperServer SYS-521C-NR 1x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 2U 12x3.5'' HDD 2x1200W PSU Via AIOM & AOC 4x8 FHFL/2x16 FHHL PCI-E 2x PCIe3.0x 2xM-key, 2280, 22110

    

     

1x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 2U 12x3.5'' HDD 2x1200W PSU Via AIOM & AOC

Key Applications

  • Cloud Computing
  • Data Center Optimized
  • Network Appliance
  • AI inferencing, ML training
  • Database/Storage
Towar dostępny na zamówienie
SKU
SYS-521C-NR

Complete System Only

UP SuperServer SYS-521C-NR

Cloud Computing
Data Center Optimized
Network Appliance
AI inferencing, ML training
Database/Storage


Key Features

  1. Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors. Up to 350W TDP
  2. Intel® C741 Chipset
  3. 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 4800 MT/s
  4. 2 PCIe 5.0 x16 FHFL + 2 PCIe 5.0 x16 FHHL (OR) 4 PCIe 5.0 x8 FHFL and 2 PCIe 5.0 x16 FHHL;
    1 PCIe 5.0 x16 AIOM NIC(OCP 3.0);
    2 PCIe 3.0 x2 NVMe M.2
  5. Single AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
  6. 12x front hot-swap 3.5" SATA3 drive bays (Optional 2 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
  7. Redundant Titanium 1200W Power Supplies

Specifications

Motherboard
board Super X13SEDW-F
Processor
CPU Single Socket E (LGA-4677)
 4th Gen Intel® Xeon® Scalable processors 
Cores Up to 60C/120T; Up to 112.5MB Cache
Note Supports up to 350W TDP CPUs (Aircooled)
System Memory
Memory Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Memory Type: 4800/4400MHz ECC DDR5 RDIMM
Memory Voltage 1.1 V
Error Detection ECC
On-Board Devices (per Node) 
NVMe/SATA NVMe; SATA3 (6Gbps); RAID 0/1/5/10 support 
Chipset Intel® C741
Network Connectivity  Via AIOM & AOC 
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN  Via AIOM & AOC 
SATA 12 SATA (6Gbps) port(s) 
USB 2 USB 2.0 port(s) (2 headers)
2 USB 3.2 Gen 1 port(s) (2 rear)
Video 1 VGA port(s)
Serial Port 1 COM Port(s) (1 COM)
System BIOS
BIOS Type AMI 32MB SPI Flash EEPROM
Management
Software IPMI2.0
Redfish API
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Power Configurations ACPI Power Management
PC Health Monitoring
CPU 8 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmount 
Model CSE-LA26TS-R1K23AWP1 
Dimensions
Height 3.5" (89mm)
Width 17.2" (437mm)
Depth 25.5" (648mm)
Package 11.4" (H) x 26.7" (W) x 34.5" (D)
Weight Net Weight: 33 lbs (15 kg)
Gross Weight: 59 lbs (26.76 kg)
Available Color Silver/Black
Front Panel
Buttons Power On/Off 
UID button
LEDs Drive activity
Network activity
Power status
Universal Information (UID)
Expansion Slots
PCI-Express (PCIe) 4 PCIe 5.0 x8 FHFL slot(s)
2 PCIe 5.0 x16 FHHL slot(s)
Note
AIOM slot shares PCIe lanes with NVMe drives. Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length)
Drive Bays / Storage (per Node) 
Drive Bays 12x 3.5" NVMe/SATA/SAS drive bays (2x 3.5" NVMe hybrid) 
M.2 2x PCIe 3.0 x 2
M-key, 2280, 22110
Peripheral Bays no
System Cooling
Fans 3 heavy duty PWM 80x80x38mm Fan(s)
 Power Supply
PSU 1U 1200W/1000W Titanium Power Supply W/PMbus W76xL336xH40mm
Dimension (W x H x L) 76 x 40 x 336 mm 
AC Input 
1000W: 100-127Vac / 15A-12A / 50-60Hz
1200W: 200-240Vac / 8.5A-7A / 50-60Hz
Output Type  19 Pairs Gold Finger Connector
Certification Titanium Level 
Operating Environment
Environmental Spec.
Operating Temperature: 
Operating Temperature: 
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
8% to 90% (non-condensing)
Non-operating Relative Humidity: 
5% to 95% (non-condensing)
Więcej informacji
Rozmiar obudowy 2U Rack
ilość nodów 1
Procesor CPU Intel® Xeon® Scalable, 4th Gen Intel® Xeon® Scalable processors, 5th Gen Intel® Xeon® Processors
Producent Procesora Intel
podstawka procesora LGA-4677 (Socket E)
Chipset Intel C741
ILOŚĆ PROCESORÓW 1xCPU
ilość slotów pamięci 16 DIMM slots
Typ pamięci DDR5 DIMM
Total PCI-E Slots# 6
ilość GPU/HPC 2, 4
interfejs SSD/HDD PCIe 4.0 x4, PCIe 3.0 x4/x8, 16G SAS, 24G SAS, SATA
rozmiar kieszeni hdd/ssd 2.5 (SFF)+3.5 (LFF)
złącza M.2 2
moc zasilaczy 1200W
ceryfikaty zasilaczy 80 plus Titanium
redundancja zasilaczy tak, 1+1
Application GPU server, Storage, Software Defined Storage, Storage Area Network, Small Business
Gwarancja 3 lata
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