Supermicro SuperServer SYS-611C-TN4R 2x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 1U 4x3.5'' HDD 2x860W PSU 1vIPMI 2FHHL PCI-E 2 PCIe 5.0 x16 AIOM (OCP 3.0)

Supermicro SuperServer SYS-611C-TN4R 2x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 1U 4x3.5'' HDD 2x860W PSU 1vIPMI 2FHHL PCI-E 2 PCIe 5.0 x16 AIOM (OCP 3.0)

Supermicro SuperServer SYS-611C-TN4R 2x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 1U 4x3.5'' HDD 2x860W PSU 1vIPMI 2FHHL PCI-E 2 PCIe 5.0 x16 AIOM (OCP 3.0)

    

     

2x Socket E (LGA-4677) 4rd Gen Intel® Xeon® Scalable CPU 16 DIMM DDR5 1U 4x3.5'' HDD 2x860W PSU 1vIPMI

Key Applications

  • Web Server, Firewall Application
  • Data Center Optimized, Value IaaS
  • Cloud Computing, Compact Server
  • DNS & Gateway Servers, Firewall Application
  • CDN, Edge Nodes
Towar dostępny na zamówienie
SKU
SYS-611C-TN4R

Complete System Only

CloudDC SuperServer SYS-611C-TN4R

Web Server, Firewall Application
Data Center Optimized, Value IaaS
Cloud Computing, Compact Server
DNS & Gateway Servers, Firewall Application
CDN, Edge Nodes


Key Features

  1. Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors
  2. 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM
  3. 2 PCIe 5.0 x16 FHHL;
    2 PCIe 5.0 x16 AIOM (OCP 3.0);
    2 PCIe 5.0 x4 NVMe M.2
  4. Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
  5. 4x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
  6. 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds
  7. 860W redundant Platinum level 100-240Vac and 200-240 Vdc power supplies
  8. 1 VGA, 1 COM, 2 USB 3.0 (rear)

Specifications

Motherboard
  Super X13DDW-A
Processor
CPU Dual Socket E (LGA-4677)
 4th Gen Intel® Xeon® Scalable processors 
Cores Up to 52C/104T; Up to 97.5MB Cache
Note Supports up to 270W TDP CPUs (Aircooled)
System Memory
Memory Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5 RDIMM
Memory Voltage 1.1 V
Error Detection ECC
On-Board Devices (per Node) 
Note High TDP 200-400G NICs have support conditions due to thermal requirements.
Chipset Intel® C741
Network Connectivity with Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network Card(s) under Optional Parts List for options)
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated BMC LAN port
USB 2 USB 3.0 port(s) (2 rear)
Video 1 VGA port(s)
Serial Port 1 COM Port(s) (1 rear)
System BIOS
BIOS Type AMI 32MB SPI FLASH ROM
Management
Software SCC
Redfish API
IPMI 2.0
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations ACPI Power Management
PC Health Monitoring
CPU 4+1 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory.
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor 1U Rackmount 
Model CSE-LA15TQC-R860AW2 
Dimensions
Height 1.7" (43mm)
Width 17.2" (437mm)
Depth 25.6" (650mm)
Package 7.8" (H) x 23.8" (W) x 34.6" (D)
Weight Net Weight: 25.5 lbs (11.6 kg)
Gross Weight: 41.5 lbs (18.8 kg)
Available Color Black front & sliver body
Front Panel
Buttons Power On/Off
Reset button
Universal Information (UID)
LEDs Drive activity
Network activity
Power status
Universal Information (UID)
Expansion Slots
PCI-Express (PCIe) 2 PCIe 5.0 x16 FHHL slot(s)
Note
Default loadout. (For more configs, please contact sales)
FH slots can be reconfigured with RSC-W2-688G5. Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length)
Drive Bays / Storage (per Node) 
Drive Bays

4x 3.5" hot-swap NVMe/SATA/SAS drive bays (4x 3.5" NVMe hybrid) (Storage drives require additional cables from the optional parts list.) 

2x 2.5" drive bays (optional)

M.2 2 M.2 NVMe
M-Key, 2280
System Cooling
Fans 6x 4cm heavy duty fans with optimal fan speed control 
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
 Power Supply
PSU 800W/860W 1U redundant power supply
Dimension (W x H x L) 54.5 x 40.25 x 322 mm 
AC Input 800W: 100-127Vac / 9A-7.5A / 50-60Hz
860W: 200-240Vac / 6A-4.5A / 50-60Hz

 

+12V
 

Max: 66.6A / Min: 0A (100Vac-127Vac)
Max: 71.6A / Min: 0A (200Vac-240Vac)
Output Type  Backplanes (gold finger)
5V SB Max: 4A / Min: 0A 
Certification Platinum Level 
Operating Environment
Environmental Spec.
Operating Temperature: 
Operating Temperature: 
   10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
   -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
   8% to 90% (non-condensing)
Non-operating Relative Humidity: 
   5% to 95% (non-condensing)
Więcej informacji
Rozmiar obudowy 1U Rack
ilość nodów 1
Procesor CPU Intel® Xeon® Scalable
Producent Procesora Intel
podstawka procesora LGA-4677 (Socket E)
Chipset Intel C741
ILOŚĆ PROCESORÓW 2xCPU
ilość slotów pamięci 16 DIMM slots
Typ pamięci DDR5 DIMM
Standard pamięci DDR5-4800 MHz
interfejs SSD/HDD PCIe 5.0, SATA
rozmiar kieszeni hdd/ssd 3.5 (LFF)
kieszenie 2.5'' 4
kieszenie 3.5'' 4
złącza M.2 2
moc zasilaczy 860W
ceryfikaty zasilaczy 80 plus Platinum
redundancja zasilaczy tak
Gwarancja 3 lata
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