Key Applications:
Virtualization
Cloud Computing
Data Center Optimized
Entry GPU server
Value IaaS
| Motherboard | |
| board | Super X13SEW-F |
| Processor | |
| CPU | Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors |
| Cores | Up to 52C/104T; Up to 97.5MB Cache |
| Note | Supports up to 300W TDP CPUs (Aircooled) |
| System Memory |
|
| Memory | Memory Capacity: 8 DIMM slots Up to 2TB: 8x 256 GB DRAM Memory Type: 4800/4400MHz ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| Error Detection | ECC |
| On-Board Devices |
|
| SATA |
SATA3 (6Gbps); RAID 0/1/5/10 support 8 SATA (6Gbps) port(s) |
| Chipset | Intel® C741 |
| Network Connectivity | 2x 1GbE BaseT with Intel® i210 |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output (per Node) | |
| LAN | 1 RJ45 Dedicated IPMI LAN port 2 RJ45 1GbE LAN ports |
| USB | 4 USB 3.2 Gen 1 port(s) (2 headers; 2 rear) 3 USB 2.0 port(s) (2 rear; 1 Type A) |
| Video | 1 VGA port(s) |
| Serial Port | 2 COM Port(s) (1 header; 1 rear) |
| DOM | 2 SuperDOM (Disk on Module) port with built-in power |
| System BIOS | |
| BIOS Type | AMI 256MB SPI Flash |
| Management | |
| Software | IPMI2.0 Redfish API SSM Intel® Node Manager SPM KVM with dedicated LAN SUM NMI |
| Power Configurations | ACPI/APM Power Management |
| PC Health Monitoring | |
| CPU | 8 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | CPU thermal trip support, PEPI Monitoring for CPU and chassis environment |
| Chassis | |
| Form Factor | 1U Rackmount |
| Model | CSE-815BTS-R860WP |
| Dimensions | |
| Height | 1.7" (43mm) |
| Width | 17.2" (437mm) |
| Depth | 25.6" (650mm) |
| Package | 8.5" (H) x 23.5" (W) x 33.7" (D) |
| Weight | Net Weight: 22 lbs (9.98 kg) Gross Weight: 46 lbs (20.87 kg) |
| Available Color | Black |
| Front Panel | |
| Buttons | Power On/Off System Reset UID button |
| LEDs | Device Activity LAN 1 Activity LAN 2 Activity Power status System information |
| Expansion Slots | |
| PCI-Express (PCIe) |
2 PCIe 5.0 x16 FHFL slot(s) FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length) |
| Drive Bays / Storage (per Node) | |
| Hot-swap |
4x 3.5" SATA/SAS drive bays Peripheral Bays |
| M.2 | 1x PCIe 3.0 x 2 M-key, 2280, 22110 |
| System Cooling | |
| Fans | 1 AOC cooling Fan(s) (optional) 5 middle cooling PWM 40x40x56mm Fan(s) |
| Power Supply | |
| PSU | 800W/860W 1U redundant power supply |
| Dimension (W x H x L) | 54.5 x 40.25 x 322 mm |
| AC Input | 800W: 100-127Vac / 9A-7.5A / 50-60Hz 860W: 200-240Vac / 6A-4.5A / 50-60Hz |
| +12V | Max: 66.6A / Min: 0A (100Vac-127Vac) Max: 71.6A / Min: 0A (200Vac-240Vac) |
| 5V SB | Max: 4A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Certification | Platinum Level |
| Operating Environment | |
| Environmental Spec. Operating Temperature: |
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Rozmiar obudowy | 1U Rack |
|---|---|
| ilość nodów | 1 |
| Procesor CPU | Intel® Xeon® Scalable |
| Producent Procesora | Intel |
| podstawka procesora | LGA-4677 (Socket E) |
| Chipset | Intel C741 |
| ILOŚĆ PROCESORÓW | 1xCPU |
| ilość slotów pamięci | 8 DIMM slots |
| Typ pamięci | DDR5 DIMM |
| Standard pamięci | DDR5-4800 MHz |
| interfejs SSD/HDD | PCIe 5.0, PCIe 3.0 x4/x8, SATA |
| rozmiar kieszeni hdd/ssd | 2.5 (SFF)+3.5 (LFF) |
| kieszenie 2.5'' | 2 |
| kieszenie 3.5'' | 4 |
| złącza M.2 | 2 |
| moc zasilaczy | 860W |
| ceryfikaty zasilaczy | 80 plus Platinum |
| redundancja zasilaczy | tak |
Konfiguracja
