Gigabyte 1U GPU E162-220 Edge Server Socket P+ 16 x DIMM 2 x 2.5" SATA/SAS/Gen4 NVMe 3 x M.2 1 x OCP 3.0 800W

E162-220  (rev. 100)

Edge Server – 1U 3rd Gen. Intel® Xeon® Scalable server system  | Application: AI  &  Edge 

Supports up to 1 x double slot GPU card
NVIDIA-Certified system for scalability, functionality, security, and performance

• 3rd Gen. Intel® Xeon® Scalable Processors
• 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs
• Supports Intel® Optane™ Persistent Memory 200 series
• Dual ROM Architecture supported
• Intel® C621A Chipset
• 1 x Dedicated management port
• 2 x 2.5" SATA/SAS/NVMe hot-swappable HDD/SSD bays
  3 x Ultra-Fast M.2 and with PCIe Gen4/3 x4 bandwidth
• 1 x Full-height Full-length PCIe Gen4 expansion slot
• 2 x Low-Profile PCIe Gen4 expansion slots
• 1 x OCP 3.0 Gen4 x16 mezzanine slot
• Redundant 800W 80 PLUS Platinum hot-swap power supply

3rd Gen Intel® Xeon® Scalable Processors – “Ice Lake”

GIGABYTE servers and Intel Xeon Scalable Processors deliver incredible 1P/2P performance from edge to data center with incredible gains in I/O throughput and workload demands that need high performing CPUs with large, yet optimized, memory configurations.

Enhanced I/0: Support for PCIe 4.0 allows for double the throughput of PCIe 3.0 for fast and large data transfers. Also, 64 lanes per socket with up to 128 lanes in a 2P configuration for fast data transmission from CPU to GPU, accelerator or storage.
CPU Performance Boost: Now up to 40 cores per socket with greatly improved IPC on Intel’s 10nm architecture while operating CPUs at 105-270W. Also, an additional UPI lane is added for up to 11.2GT/s for a low latency interconnect between CPUs.
Next Gen Memory: Each processor provides eight memory channels to support 8 or 16 DIMM slots with up to DDR4-3200. There are two sub-clustering modes, Sub NUMA (SNC) and Hemisphere (HEMI), available using balanced memory that results in performance improvements. Additionally, support for Intel Optane PMem 200 series provides two modes for greater memory capacity and data persistence to process large amounts of data faster.
Next Level Security: New instructions and architecture deliver a high level of cryptographic operations for data privacy and protection. Cryptographic accelerators speed up encryption protocols as well as improvements in software guard extensions and memory encryption are added.
AI Acceleration: AI inference and training are enhanced with DL Boost Technology for greater business, operational, and security insights. Applications include HPC, AI, and Media & Graphics.

High Performance
OCP 3.0 Ready

GIGABYTE offers servers that feature an onboard OCP 3.0 slot for the next generation of add on cards. Advantages of this new type include:

Easy Serviceability: simply slot in or pull out the card, without opening the server or using tools
Improved thermal design: horizontal position and optimal heat sink design allow for air cooling to eliminate the heat efficiently

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 500
Motherboard
ME62-GE0
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
Socket
1 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture per processor
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
2 x 2.5" SATA/SAS/Gen4 NVMe hot-swappable HDD/SSD bays

SAS card is required for SAS devices support
SAS
N/A
RAID
Intel® SATA RAID 0, 1
Peripheral Drives
N/A

Expansion Slots
1 x Full-height Full-length PCIe Gen4 x16 expansion slot
2 x Low-Profile PCIe Gen4 x16 expansion slots
1 x OCP 3.0 Gen4 x16 mezzanine slot

2 x M.2 slots:
- M-key
- PCIe Gen4 x4 from CPU
- Supports NGFF-2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4 from C621A
- Supports NGFF-2280/22110 cards
Internal I/O
3 x M.2 slots
2 x SATA ports
1 x TPM header
Front I/O
2 x USB 3.0
1 x miniDP
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Rear I/O
N/A
Backplane I/O
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port or PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 800W hot-swappable redundant power supply
80 PLUS Platinum

AC Input:
- 100-240V~/ 10A-5A, 50-60Hz

DC Input:
- 240Vdc/ 4A

DC Output:
- Max 800W/ 100-240V~
+ 12V/ 65A
+ 12Vsb/ 2.1A

System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage/Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP/AD/RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later
System Fans
6 x 40x40x56mm (29,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
786 x 588 x 250 mm
Packaging Content
1 x E162-220
1 x CPU heatsinks
1 x Rail kit (optional)
Part Numbers
- Barebone package: 6NE162220MR-00
- Motherboard: 9ME62GE0NR-00
- VROC module: 25FD0-R181N0-10R
(Supported for Intel SSD only, optional)
- Rail kit 900mm for IT: 25HB2-3A0203-K0R (optional)
- Rail kit 600mm for Telcom: 25HB2-3A0204-K0R (optional)
- CPU heatsink: 25ST1-453213-M1R
- Back plane board: 9CBPE020NR-00
- Fan module: 25ST2-405628-S1R
- Power supply: 25EP0-208007-F3S
- Riser card - CRSE010: 9CRSE010NR-00
- Riser card - CRSE011: 9CRSE011NR-00
- Riser card - CRSE012: 9CRSE012NR-00